隨附 AWG 26-24 觸點和插入 / 拔取工具
Lightweight design and very high density, microComp? is an alternative to HD DSUB with superior characteristics,A flexible alternative to MIL-STD 83513 connectors.
Dismountable contacts for wiring flexibility
Lightweight composite materials
High vibration withstanding
| 屬性 | 數值 |
|---|---|
| 觸點數目 | 104 |
| 性別 | 母座 |
| 主體定位 | 直向 |
| 安裝類型 | 電纜安裝 |
| 節距 | 2mm |
| 端接方法 | 壓接 |
| 額定電流 | 2.5A |
| 外殼材料 | 玻璃纖維增強復合材料 |
| 長度 | 62.75mm |
| 寬度 | 11.11mm |
| 深度 | 12.5mm |
| 觸點材料 | 銅合金 |
| 尺寸 | 62.75 x 11.11 x 12.5mm |
| 觸點電鍍 | 金 |
| 系列 | MicroComp |
